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1銆丠HM-PCD, Crashed by the high toughness quality diamond, utilizing the professional
production process. Main character
is high impact toughness and good thermal stability,
high wear resistance, high purity and low particle impurity. Designed
for PDC, PCD, polycrystalline dies and electroplate products.
2銆丠HM-DW, selected from the high toughness quality diamond as the raw material,
adopting the special production
procedure, HHM-DW diamond micron has a regular shape, concentrated PSD, high toughness,
low impurity, good dispersity
and wear resistance. After nickel coated, the diamond and wire can well embedded
in the matrix.
Applied for cutting, grinding and polishing of organic and inorganic hard fragile
material, such as the diamond cutting tools
like diamond wire, gem blade, semiconductor blade; diamond grinding or polishing
tools used on the monocrstalline silicon,
polycrystalline silicon, diamond, gemstone, sapphire, LED sapphire substrate, LCD
glass, high precision magnetic material
and semiconductor.
3銆丠HM-SF, HHM-SF is a super fine size diamond micron, diamond size is in sub-micron
and nanometer. Concentrate PSD
and no oversize particles, mainly apply for super fine polishing tools which used
on gemstone, semiconductor, optical
instrument, as well as aerospace, precision machinery, and automotive manufacturing
industry. It also can be used as
additive on composite material and lubricating materials.
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